Filter the results Item type Select All/None Language Root Folder ResOUMailForm ResOUFeatureFolder ResOUFeature ResOUResearch ResOUPage Language Independent Folder Image Folder ResOUStory ResOUStoryFolder ResOUResearchFolder Link New items since Yesterday Last week Last month Ever Search results 2 items matching your search terms. Sort by relevance date (newest first) alphabetically Copper and PTFE stick together to support better 5G Researchers from Osaka University have demonstrated a process for improving the adhesion of copper foil to polytetrafluoroethylene (PTFE) surfaces. The ... Located in Research Info / 2021 Current events: Improved reliability of printed circuit boards Researchers from Osaka University have improved the electrical interconnects that are essential features of advanced printed circuit boards. By eliminating the ... Located in Research Info / 2022
