Filter the results Item type Select All/None Folder ResOUFeatureFolder Language Independent Folder Image Language Root Folder ResOUResearch ResOUStory ResOUMailForm ResOUStoryFolder ResOUResearchFolder Link ResOUFeature New items since Yesterday Last week Last month Ever Search results 2 items matching your search terms. Sort by relevance date (newest first) alphabetically A golden ticket to smaller electronics Osaka University researchers used sputtered silver to bond copper electrodes as part of 3D integrated circuits. By gently annealing the silver layers, enough ... Located in Research Info / 2022 Copper and PTFE stick together to support better 5G Researchers from Osaka University have demonstrated a process for improving the adhesion of copper foil to polytetrafluoroethylene (PTFE) surfaces. The ... Located in Research Info / 2021
